PolyMide™ is a family of Nylon/polyamide based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing.
PolyMide™ CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and heat resistance of up to 180˚C.
PolyMide™ CoPA features Polymaker's Warp-Free™ technology:
Warp-Free™ technology enables the production of Nylon-based filaments that can be 3D printed with excellent dimensional stability and near-zero warpage. This is achieved by the fine control of microstructure and crystallization behavior of Nylon, which enables the material to fully release the internal stress before solidification.
2223 ± 199 Mpa
66.2 ± 0.9 Mpa
97.0 ± 1.1 Mpa
Charpy Impact Strength:
9.6 ± 1.4 kJ/m2
Glass Transition Temperature:
Vicat Softening Temperature:
||NET WEIGHT: 0.75 KG (1.65 LB)
|250°C - 270°C
30mm/s – 50mm/s
25˚C – 70˚C
Glass with glue
80˚C for 12h
Recommended Support Materials:
It is highly recommended to use the dry box when printing with PolyMide™ CoPA and to store it in the resealable bag.
To ensure a good heat resistance of your printed part it is recommended to anneal your PolyMide™ CoPA 3d printed model.
Annealing settings: 70˚C for 2h